29 RXD3 O Receive Data 3: Bit 3 of the 4 data bits that sent by the PHY in the receive path. Package Description Additional Information 4 DS3, 2008-11 1 Package Description The exposed die pad PG-LQFP-64/100/144 (Plastic Green - Low profile Quad Flat Package), (Figure 1) is based on a plastic encapsulated LQFP package. 16) FP (Flat Package) Flat Package is one of the surface mount packages. The main difference between SH7144 series and SH7040 series are as follows; . QFP/TQFP/LQFP 32/44/48/64/100/144 pin to DIP Pin Board Adapter ... PDF Recommendations for Printed Circuit Board Assembly of Infineon PG-LQFP ... PDF TCoB Reliability For Epad LQFP 176 in Automotive Application PDF January 22, 2008 Dear Valued Exar Corporation Customer, Package Description Additional Information 4 DS3, 2008-11 1 Package Description The exposed die pad PG-LQFP-64/100/144 (Plastic Green - Low profile Quad Flat Package), (Figure 1) is based on a plastic encapsulated LQFP package. QFPs are surface mounted and can be thermally enhanced through an exposed pad. The leads are formed in a gull wing shape to allow solid footing during assembly to a PCB. Thin Quad Flat Pack, or TQFP, is a surface-mount IC package with gull-wing leads on all four sides of the package body. PDF Recommendations for Printed Circuit Board Assembly of Infineon PG-LQFP ... The meaning and difference of various IC packages Quad flat package - Wikipedia LQFP (Low Profile Quad Flat Package) LQFP is a kind of QFP whose package body thickness is 1.4 mm and this is the name used by the Japanese Electronics and Machinery Industry according to the new QFP shape specification. Pins are numbered counter-clockwise from the index dot. Another thermal enhancement for QFP packages is an internal spreader. Applications for this robust package can include commercial, automotive, and industrial products.
